SMT Technology

ESD electrostatic protection During the manufacturing and testing of electronic products, high-voltage electrostatic discharge (ESD) may be generated due to static electricity generated by human activities, which will cause poor product quality and equipment insulation damage. Therefore, the electronics factory attaches great importance to electrostatic protection, and uses the following protective measures PVC anti-static floor is laid on the ground of the floor; grounding wire is installed on the equipment and desktop; Personnel electrostatic protection: anti-static clothing, static ring, static shoes; Grounding network monitoring, regular inspections, and spot checks on the grounding of equipment desktops. And monitoring personnel test the data of electrostatic path impedance every day to monitor the performance of electrostatic wristbands and electrostatic shoes.

Humidity sensor control A small amount of moisture in the environment will be absorbed into the gaps of electronic parts due to material reasons, Sensitive parts will affect the yield and reliability of finished and semi-finished electronic products For moisture-sensitive components, attention should be paid to packaging, transportation, storage and prevention of moisture absorption To effectively dry and dehumidify the humidity sensitive element, you can use a baking or drying oven, drying equipment

SMT production line- Solder Paste Inspection Machine SPI solder paste inspection machine, placed after the solder paste printing machine and before the printing machine, uses optical images to check the quality of solder paste printing. Regarding height, volume, area, short circuit and offset, etc., it can check the solder paste Paste poorly printed PCB boards to improve the yield of SMT soldering and reduce maintenance troubles for subsequent circuit boards

X-ray inspection machine Use the principle of X-ray transmission to detect the internal structure of the object to be tested when welding parts such as BGA Some adverse conditions are suitable for inspection by X-ray inspection machine For example, BGA parts soldering short circuit, virtual soldering, air bubble rate, IC pin offset and other problems that are difficult to find with the naked eye (Bubble rate, after the parts are welded, there will be voids in the solder joints, too many voids will affect the reliability of welding)